What mechanical stresses and assembly forces should be avoided when integrating an optically bonded Sigma TDS?
Avoid tensile pull, shear, compression, torsion, uneven stress, and concentrated loads on the touch panel, LCD, or optical-bonding layer. The enclosure should have sufficient rigidity and mechanical clearance so the front or rear cover does not press on the display under worst-case tolerance, deformation, shock, or vibration. During assembly, apply force only to the rigid support walls of the intended mounting or hook-snapped zone and avoid tilting the module, which can transfer lateral stress to the LCD substrate. Do not apply concentrated force to the LCD, touch sensor, or front glass.
